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Low Input Current, High Gain Optocouplers Technical Data
6N139 HCPL-0701 HCNW139 6N138 HCPL-0700 HCNW138
Features
* High Current Transfer Ratio - 2000% Typical (4500% Typical for HCNW139/138) * Low Input Current Requirements - 0.5 mA * TTL Compatible Output - 0.1 V VOL Typical * Performance Guaranteed over Temperature 0C to 70C * Base Access Allows Gain Bandwidth Adjustment * High Output Current - 60 mA * Safety Approval UL Recognized - 2500 V rms for 1 Minute and 5000 V rms* for 1 Minute per UL 1577 CSA Approved VDE 0884 Approved with VIORM = 1414 V peak for HCNW139 and HCNW138 BSI Certified (HCNW139 and HCNW138) * Available in 8-Pin DIP or SOIC-8 Footprint or Widebody Package *MIL-STD-1772 Version Available (HCPL-5700/1)
Applications
* Ground Isolate Most Logic Families - TTL/TTL, CMOS/ TTL, CMOS/CMOS, LSTTL/ TTL, CMOS/LSTTL * Low Input Current Line Receiver * High Voltage Insulation (HCNW139/138) * EIA RS-232C Line Receiver * Telephone Ring Detector * 117 V ac Line Voltage Status Indicator - Low Input Power Dissipation * Low Power Systems - Ground Isolation
Description
These high gain series couplers use a Light Emitting Diode and an integrated high gain photodetector to provide extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage result in TTL compatible saturation voltages and high speed operation. Where desired the VCC and VO terminals may be tied together to achieve conventional photodarlington operation. A base access terminal allows a gain bandwidth adjustment to be made.
Functional Diagram
NC 1 ANODE 2 CATHODE 3 NC 4 8 VCC 7 VB 6 VO 5 GND TRUTH TABLE LED VO ON LOW OFF HIGH
*5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only. A 0.1 F bypass capacitor connected between pins 8 and 5 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
2
The 6N139, HCPL-0701, and CNW139 are for use in CMOS, LSTTL or other low power applications. A 400% minimum current transfer ratio is guaranteed over 0 to 70C operating range for only 0.5 mA of LED current. The 6N138, HCPL-0700, and HCNW138 are designed for use mainly in TTL applications. Current Transfer Ratio (CTR) is 300% minimum over 0 to 70C for an LED current of 1.6 mA
(1 TTL Unit load ). A 300% minimum CTR enables operation with 1 TTL Load using a 2.2 k pull-up resistor. Selection for lower input current down to 250 A is available upon request. The HCPL-0701 and HCPL-0700 are surface mount devices packaged in an industry standard SOIC-8 footprint.
The SOIC-8 does not require "through holes" in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. The HCNW139 and HCNW138 are packaged in a widebody encapsulation that provides creepage and clearance dimensions suitable for safety approval by regulatory agencies worldwide.
Selection Guide
8-Pin DIP (300 Mil) Single Channel Package 6N139 6N138 HCPL-4701[1] Dual Channel Package HCPL2731[1] 2730[1] 4731[1] Widebody Package (400 mil) Single Channel Package HCNW139 HCNW138 Minimum Input ON Current (IF ) 0.5 mA 1.6 mA 40 A 0.5 mA Absolute Maximum VCC 18 V 7V 18 V 20 V 5701[1] 5700[1] 5731[1] 5730[1] Hermetic Single and Dual Channel Packages HCPL-
Small Outline SO-8 Single Dual Channel Channel Package Package HCPLHCPL0701 0700 070A[1] 0731 0730 073A[1]
Minimum CTR 400% 300% 800% 300%
Note: 1. Technical data are on separate HP publications.
3
Ordering Information
Specify Part Number followed by Option Number (if desired). Example: 6N139#XXX 020 = 5000 V rms/1 Minute UL Rating Option* 300 = Gull Wing Surface Mount Option 500 = Tape and Reel Packaging Option Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for information.
*For 6N139 and 6N138 only. Gull wing surface mount option applies to through hole parts only.
Schematic
VCC 8 ICC 2 ANODE + VF CATHODE - 3 IO 6 VO IF
5 SHIELD
GND
IB 7 VB
4
Package Outline Drawings
8-Pin DIP Package (6N139/6N138)**
9.65 0.25 (0.380 0.010) TYPE NUMBER 8 7 6 5
7.62 0.25 (0.300 0.010) 6.35 0.25 (0.250 0.010)
OPTION CODE* DATE CODE
HP XXXXZ YYWW RU 1 1.19 (0.047) MAX. 2 3 4
UL RECOGNITION
1.78 (0.070) MAX. + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002)
5 TYP. 4.70 (0.185) MAX.
0.51 (0.020) MIN. 2.92 (0.115) MIN.
1.080 0.320 (0.043 0.013)
0.65 (0.025) MAX. 2.54 0.25 (0.100 0.010) DIMENSIONS IN MILLIMETERS AND (INCHES). *MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 OPTION NUMBERS 300 AND 500 NOT MARKED.
**JEDEC Registered Data.
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)
PAD LOCATION (FOR REFERENCE ONLY) 9.65 0.25 (0.380 0.010)
8 7 6 5
1.016 (0.040) 1.194 (0.047)
4.826 TYP. (0.190) 6.350 0.25 (0.250 0.010) 9.398 (0.370) 9.906 (0.390)
1
2
3
4
1.194 (0.047) 1.778 (0.070) 1.780 (0.070) MAX. 9.65 0.25 (0.380 0.010) 7.62 0.25 (0.300 0.010)
0.381 (0.015) 0.635 (0.025)
1.19 (0.047) MAX.
4.19 MAX. (0.165)
+ 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002)
1.080 0.320 (0.043 0.013) 0.635 0.130 2.54 (0.025 0.005) (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 0.25 (0.025 0.010)
12 NOM.
5
Small Outline SO-8 Package (HCPL-0701/HCPL-0700)
8
7
6
5
3.937 0.127 (0.155 0.005)
XXX YWW
5.994 0.203 (0.236 0.008) TYPE NUMBER (LAST 3 DIGITS) DATE CODE
4
PIN ONE 1 0.406 0.076 (0.016 0.003)
2
3
1.270 BSG (0.050) * 5.080 0.127 (0.200 0.005) 7 0.432 (0.017)
45 X
3.175 0.127 (0.125 0.005)
0 ~ 7 1.524 (0.060) 0.203 0.102 (0.008 0.004)
0.228 0.025 (0.009 0.001)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 0.254 (0.205 0.010) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.305 MIN. (0.012)
8-Pin Widebody DIP Package (HCNW139/HCNW138)
11.15 0.15 (0.442 0.006)
8 7 6 5
11.00 MAX. (0.433) 9.00 0.15 (0.354 0.006) TYPE NUMBER DATE CODE
HP HCNWXXXX YYWW
1
2
3
4
1.55 (0.061) MAX.
10.16 (0.400) TYP. 7 TYP. + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 5.10 MAX. (0.201)
3.10 (0.122) 3.90 (0.154) 2.54 (0.100) TYP. 1.78 0.15 (0.070 0.006) 0.40 (0.016) 0.56 (0.022)
0.51 (0.021) MIN.
DIMENSIONS IN MILLIMETERS (INCHES).
6
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)
11.15 0.15 (0.442 0.006)
8 7 6 5
PAD LOCATION (FOR REFERENCE ONLY)
6.15 (0.242)TYP. 9.00 0.15 (0.354 0.006) 12.30 0.30 (0.484 0.012)
1 2 3 4
1.3 (0.051) 1.55 (0.061) MAX. 12.30 0.30 (0.484 0.012) 11.00 MAX. (0.433)
0.9 (0.035)
4.00 MAX. (0.158)
1.78 0.15 (0.070 0.006) 2.54 (0.100) BSC 0.75 0.25 (0.030 0.010)
1.00 0.15 (0.039 0.006)
+ 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 7 NOM.
DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
Solder Reflow Temperature Profile (HCPL-07XX and Gull Wing Surface Mount Option 300 Parts)
260 240 220 200 180 160 140 120 100 80 60 40 20 0 0 1 T = 100C, 1.5C/SEC T = 145C, 1C/SEC T = 115C, 0.3C/SEC
TEMPERATURE - C
2
3
4
5
6
7
8
9
10
11
12
TIME - MINUTES
Note: Use of nonchlorine activated fluxes is highly recommended.
7
Regulatory Information
The 6N139/138, HCNW139/138, and HCPL-0701/0700 have been approved by the following organizations: UL Recognized under UL 1577, Component Recognition Program, File E55361.
CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. VDE Approved according to VDE 0884/ 06.92 (HCNW139/138 only).
BSI Certification according to BS415:1994, (BS EN60065:1994); BS EN60950:1992 (BS7002:1992) and EN41003:1993 for Class II applications (HCNW139/ HCNW138 only.)
Insulation and Safety Related Specifications
8-Pin DIP (300 Mil) Value 7.1 SO-8 Value 4.9 Widebody (400 Mil) Value Units 9.6 mm
Parameter Minimum External Air Gap (External Clearance) Minimum External Tracking (External Creepage) Minimum Internal Plastic Gap (Internal Clearance)
Symbol L(101)
L(102)
7.4
4.8
10.0
mm
0.08
0.08
1.0
mm
Minimum Internal Tracking (Internal Creepage) Tracking Resistance (Comparative Tracking Index) Isolation Group
NA
NA
4.0
mm
CTI
200
200
200
Volts
Conditions Measured from input terminals to output terminals, shortest distance through air. Measured from input terminals to output terminals, shortest distance path along body. Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Measured from input terminals to output terminals, along internal cavity. DIN IEC 112/VDE 0303 Part 1
IIIa
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
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VDE 0884 Insulation Related Characteristics (HCNW139 and HCNW138)
Description Installation Classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage 600 V rms for rated mains voltage 1000 V rms Climatic Classification Pollution Degree (DIN VDE 0110/1.89) Maximum Working Insulation Voltage Input to Output Test Voltage, Method b* VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec, Partial Discharge < 5 pC Input to Output Test Voltage, Method a* VPR = 1.5 x VIORM, Type and Sample Test, tP = 60 sec, Partial Discharge < 5 pC Highest Allowable Overvoltage* (Transient Overvoltage, tini = 10 sec) Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 11, Thermal Derating curve.) Case Temperature Current (Input Current I F, PS = 0) Output Power Insulation Resistance at TS, VIO = 500 V Symbol Characteristic I-IV I-III 55/100/21 2 1414 2652 Units
VIORM VPR
V V
peak
peak
VPR
2121
V
peak
VIOTM
8000
V
peak
TS IS,INPUT PS,OUTPUT RS
175 400 700 > 109
C mA mW
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, (VDE 0884) for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
9
Absolute Maximum Ratings* (No Derating Required up to 85C)
Parameter Storage Temperature Operating Temperature** Average Forward Input Current Peak Forward Input Current (50% Duty Cycle, 1 ms Pulse Width) Peak Transient Input Current (<1 s Pulse Width, 300 pps) Reverse Input Voltage HCNW139/138 Input Power Dissipation Output Current (Pin 6) Emitter Base Reverse Voltage (Pin 5-7) Supply Voltage and Output Voltage (6N139, HCPL-0701, HCNW139) Supply Voltage and Output Voltage (6N138, HCPL-0700, HCNW138) Output Power Dissipation Total Power Dissipation Lead Solder Temperature (for Through Hole Devices) HCNW139/138 Reflow Temperature Profile (for SOIC-8 and Option #300)
*JEDEC Registered Data for 6N139 and 6N138. **0C to 70C on JEDEC Registration.
Symbol TS TA IF(AVG) IFPK IF(TRAN) VR PI IO VEB VCC VCC
Min. -55 -40
Max. 125 85 20 40 1.0 5 3 35 60 0.5
Units C C mA mA A V V mW mA V V V
-0.5 -0.5
18 7
PO 100 mW PT 135 mW 260C for 10 sec., 1.6 mm below seating plane 260C for 10 sec., up to seating plane See Package Outline Drawings section
Recommended Operating Conditions
Parameter Power Supply Voltage Forward Input Current (ON) Forward Input Voltage (OFF) Operating Temperature Symbol VCC IF(ON) VF(OFF) TA Min. 4.5 0.5 0 0 Max. 18 12.0 0.8 70 Units V mA V C
10
Electrical Specifications
0C TA 70C, 4.5 V VCC 18 V, 0.5 mA IF(ON) 12 mA, 0 V VF(OFF) 0.8 V, unless otherwise specified. All Typicals at TA = 25C. See Note 7. Device Min. Typ.** Max. Units Test Conditions Fig. Note 6N139 400* 2000 5000 % IF = 0.5 mA VCC = 4.5 2, 3 1, 2, HCPL-0701 VO = 0.4 V 4 HCNW139 400 4500 6N139 500* 1600 2600 IF = 1.6 mA HCPL-0701 HCNW139 500 3000 300 1600 IF = 5.0 mA 200 850 IF = 12 mA 6N138 300* 1600 2600 IF = 1.6 mA HCPL-0700 HCNW138 1500 Logic Low Output VOL 6N139 0.1 0.4 V IF = 0.5 mA, VCC = 4.5 1 2 Voltage HCPL-0701 IO = 2 mA HCNW139 IF = 1.6 mA, IO = 8 mA IF = 5.0 mA, IO = 15 mA 0.2 IF = 12 mA, IO = 24 mA 6N138 0.1 IF = 1.6 mA, HCPL-0700 IO = 4.8 mA HCNW138 Logic High IOH 6N139 0.05 100 A VO = VCC = 18 V IF = 0 mA 2 Output Current HCPL-0701 HCNW139 6N138 0.1 250 VO = VCC = 7 V HCPL-0700 HCNW138 Logic Low Supply ICCL 6N138/139 0.4 1.5 mA IF = 1.6 mA, VO = Open, 10 2 Current HCPL-0701/ VCC = 18 V 0700 HCNW139 0.5 2 HCNW138 Logic High ICCH 6N138/139 0.01 10 A IF = 0 mA, VO = Open, 2 Supply Current HCPL-0701/ VCC = 18 V 0700 HCNW139 1 HCNW138 Input Forward VF 6N138 1.25 1.40 1.7* V TA = 25C IF = 1.6 mA 4, 8 Voltage 6N139 HCPL-0701 1.75 HCPL-0700 HCNW139 1.0 1.45 1.85 TA = 25C HCNW138 0.95 1.95 Input Reverse BVR 5.0* V IR = 10 A, TA = 25C Breakdown HCNW139 3.0 IR = 100 A, TA = 25C Voltage HCNW138 Temperature VF -1.8 mV/C IF = 1.6 mA 8 Coefficient of TA Forward Voltage Input CIN 60 pF f = 1 MHz, VF = 0 V Capacitance HCNW139 90 HCNW138
*JEDEC Registered Data for 6N139 and 6N138. **All typical values at TA = 25C and VCC = 5 V, unless otherwise noted.
Parameter Current Transfer Ratio
Sym. CTR
11
Switching Specifications (AC)
Over recommended operating conditions (TA = 0 to 70C), VCC = 5 V, unless otherwise specified. Parameter Propagation Delay Time to Logic Low at Output Sym. tPHL Device Min. 6N139 HCPL-0701 HCNW139 6N139 HCPL-0701 HCNW139 6N138 HCPL-0700 HCNW138 Propagation Delay Time to Logic High at Output tPLH HCNW138 6N139 HCPL-0701 HCNW139 HCNW139 6N139 HCPL-0701 HCNW139 HCNW139 6N138 HCPL-0700 HCNW138 6N138 HCPL-0700 HCNW139 Common Mode Transient Immunity at Logic High Output Common Mode Transient Immunity at Logic Low Output |CMH | 1000 Typ.** Max. Units Test Conditions 5 25* s TA = 25C 30 IF = 0.5 mA, Rl = 4.7 k 0.2 1* s TA = 25C 2 IF = 12 mA, Rl = 270 1.1 1.6 10* s TA = 25C IF = 1.6 mA, 15 Rl = 2.2 k 11 18 60* s TA = 25C 90 IF = 0.5 mA, Rl = 4.7 k 115 2 7* s TA = 25C 10 IF = 12 mA, Rl = 270 1.1 10 35* s TA = 25C IF = 1.6 mA, Rl = 2.2 k 50 70 10000 V/s IF = 0 mA, TA = 25C Rl = 2.2 k |VCM | = 10 Vp-p IF = 1.6 mA, TA = 25C Rl = 2.2 k |VCM | = 10 Vp-p 13 5, 6 Fig. Note 5, 6, 2, 4 7, 9, 12
5, 6, 7, 9, 12
2, 4
|CML|
1000
10000
V/s
13
5, 6
*JEDEC Registered Data for 6N139 and 6N138. **All typical values at TA = 25C and VCC = 5 V, unless otherwise noted.
12
Package Characteristics
Parameter Input-Output Momentary Withstand Voltage Option 020 HCNW139 HCNW138 Resistance (Input-Output) Capacitance (Input-Output) Sym. VISO Min. Typ.** Max. Units 2500 V rms 5000 Test Conditions RH < 50%, t = 1 min., TA = 25C Fig. Note 3, 8 3, 9
RI-O CI-O
1012 0.6
pF
VI-O = 500 Vdc RH < 45% f = 1 MHz
3 3
**All typicals at TA = 25C, unless otherwise noted. The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level safety specification or HP Application Note 1074 entitled "Optocoupler Input-Output Endurance Voltage."
Notes: 1. DC CURRENT TRANSFER RATI0 (CTR) is defined as the ratio of output collector current, I O, to the forward LED input current, I F, times 100%. 2. Pin 7 Open. 3. Device considered a two-terminal device. Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together. 4. Use of a resistor between pin 5 and 7 will decrease gain and delay time. Significant reduction in overall gain can occur when using resistor values below 47 k. For more information, please contact your local HP Components representative. 5. Common mode transient immunity in a Logic High level is the maximum toler-
able (positive) dVCM /dt of the common mode pulse, VCM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V). 6. In applications where dV/dt may exceed 50,000 V/s (such as static discharge) a series resistor, RCC, should be included to protect the detector IC from destructively high surge currents. The recommended value is RCC = 220 . 7. Use of a 0.1 F bypass capacitor connected between pins 8 and 5 adjacent to the device is recommended.
8. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 3000 V rms for 1 second (leakage detection current limit, II-O < 5 A). This test is performed before the 100% production test shown in the VDE 0884 Insulation Related Characteristics Table, if applicable. 9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 V rms for 1 second (leakage detection current limit, II-O < 5 A). This test is performed before the 100% production test for partial discharge (method b) shown in the VDE 0884 Insulation Related Characteristics Table, if applicable.
13
CTR - CURRENT TRANSFER RATIO - %
IO - OUTPUT CURRENT - mA
4.0 mA
70C 25C 70C -40C
1600 1200 800 400 0 0.1 VCC = 5 V VO = 0.4 V 1.0
IO - OUTPUT CURRENT - mA
50 4.5 mA
5.0 mA
A 3.5 m A 3.0 m A 2.5 m A 2.0 m
85C 2000
100
10 TA = 85 C 1.0 TA = 70 C TA = 25 C TA = 0 C TA = -40 C 0.1 1 10
A 1.5 m
25
1.0 mA
0.5 mA
0.1
0 0
VCC = 5 V TA = 25 C 1.0 VO - OUTPUT VOLTAGE - V 2.0
10
0.01 0.01
IF - FORWARD CURRENT - mA
IF - INPUT DIODE FORWARD CURRENT - mA
Figure 1. 6N138/6N139 DC Transfer Characteristics.
Figure 2. Current Transfer Ratio vs. Forward Current 6N138/6N139.
Figure 3. 6N138/6N139 Output Current vs. Input Diode Forward Current.
1000
tP - PROPAGATION DELAY - s
tP - PROPAGATION DELAY - s
IF - FORWARD CURRENT - mA
IF + VF - TA = 85C TA = 70C TA = 25C
40 35 30 25 20 15 10 5 0 -60 -40 -20 0 20 40 60 80 100 tPHL IF = 0.5 mA RL = 4.7 k 1/f = 50 s
24 21 18 15 12 9 6 3 0 -60 -40 -20 0 20 tPHL 40 60 80 100 IF = 1.6 mA RL = 2.2 k 1/f = 50 s
100 10 1.0 0.1 0.01 0.001 1.1
tPLH
tPLH
TA = 0C TA = -40C 1.2 1.3 1.4 1.5 1.6
VF - FORWARD VOLTAGE - V
TA - TEMPERATURE - C
TA - TEMPERATURE - C
Figure 4. Input Diode Forward Current vs. Forward Voltage.
Figure 5. Propagation Delay vs. Temperature.
Figure 6. Propagation Delay vs. Temperature.
4
tP - PROPAGATION DELAY - s
VF - FORWARD VOLTAGE - V
1.6
IF = 12 mA RL = 270 k 1/f = 50 s 3
IF = 1.6 mA 1.5
100 TA = 25 C tf tr 10
tPLH
2
1.4
1 tPHL 0 -60 -40 -20 0 20 40 60 80 100
1.3
TIME - s
IF - ADJUSTED FOR VOL = 2 V
1.2 -60 -40 -20 0 20 40 60 80 100
1 0.1
1.0
10
TA - TEMPERATURE - C
TA - TEMPERATURE - C
RL - LOAD RESISTANCE - k
Figure 7. Propagation Delay vs. Temperature.
Figure 8. Forward Voltage vs. Temperature.
Figure 9. Nonsaturated Rise and Fall Times vs. Load Resistance.
14
ICCL - LOGIC LOW SUPPLY CURRENT - mA
OUTPUT POWER - PS, INPUT CURRENT - IS
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 2 4 6 8 10 12 14 16 VCC = 5 V VCC = 18 V
1000 900 800 700 600 500 400 300 200 100 0 0 25 50
WIDEBODY PS (mW) IS (mA)
75
100 125 150 175
IF - FORWARD CURRENT
TS - CASE TEMPERATURE - C
Figure 10. Logic Low Supply Current vs. Forward Current.
Figure 11. Thermal Derating Curve, Dependence of Safety Limiting Value with Case Temperature per VDE 0884.
IF 0 VO (SATURATED RESPONSE) t PHL 1.5 V 1.5 V VOL t PLH I F MONITOR RM VO (NON-SATURATED RESPONSE) tf 5V 90% 10% 90% 10% tr * INCLUDES PROBE AND FIXTURE CAPACITANCE 4 5 5V PULSE GEN. ZO = 50 t r = 5 ns IF 1 2 3 8 7 6 0.1 F CL = 15 pF* RL VO +5 V
10% DUTY CYCLE I/f < 100 s
Figure 12. Switching Test Circuit.
15
VCM
10 V 0 V 10% tr
tr, tf = 16 ns 90% 90% 10% tf
IF B
1 2 A 3
8 7 6 5
RCC (SEE NOTE 6) +5 V RL VO
VO SWITCH AT A: IF = 0 mA VO SWITCH AT B: IF = 1.6 mA
5V
VFF
4
VOL
VCM + - PULSE GEN.
Figure 13. Test Circuit for Transient Immunity and Typical Waveforms.
www.hp.com/go/isolator For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright (c) 1998 Hewlett-Packard Co. Obsoletes 5965-3599E Printed in U.S.A. 5968-1085E (7/98)

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